Turn-off overvoltage limiting for IGBT

ABSTRACT

A turn-off overvoltage limiting for IGBT is described herein. The injection of a sample of the overvoltage across the IGBT in the gate drive to slow down the slope of the gate voltage decrease only during the overvoltage above a predetermined value is described herein. Techniques to increase the parasitic inductance to allow the control to limit an overvoltage at turn off of the second IGBT are also described herein.

FIELD

The present disclosure generally relates to insulated gate bipolartransistors (IGBT). More specifically, the present disclosure isconcerned with a configuration and a method to limit the turn-offovervoltage on the IGBTs to thereby improve their overall efficiency.

BACKGROUND

With the limited space allowed for the power inverter circuits inelectric and/or electric hybrid automotive applications and the highcost of the semiconductors, the demand for integration of powerelectronics increases.

A known way of reducing the space occupied by the semiconductors invehicles inverters is to increase their efficiency to allow the size ofthe cooling surface to be reduced.

The losses in IGBT modules present in conventional inverter designs aremainly caused by two sources; conduction losses and switching losses.One way to improve IGBT module switching losses is generally byaccelerating the IGBT turn-on and turn-off. However, with faster IGBTturn-off, the overvoltage due to the stray inductance of thehigh-frequency loop increases so much that slow down of the turn-off isoften required to protect the device, thereby seriously impacting theefficiency of the inverter.

BRIEF DESCRIPTION OF THE DRAWINGS

In the appended drawings:

FIG. 1 is a circuit diagram of a typical gate drive IGBT configurationwith the high frequency loop, illustrating the stray inductances and thelogical connection where the gate drivers take their reference;

FIG. 2 is a diagram showing the current and voltage waveforms pointingout the overvoltage during short-circuit condition;

FIG. 3 is a circuit diagram of a gate drive IGBT reducing theovervoltage using a resistive divider connected across the emitter strayinductance, according to an illustrative embodiment;

FIG. 4 is a diagram showing the turn-off waveforms of an IGBT using theresistive divider in short circuit condition with a bus voltage of 500V;

FIG. 5 is a diagram showing the turn-off waveforms of an IGBT using theresistive divider adjusted for a maximum bus voltage of 300V in shortcircuit condition;

FIG. 6 is a circuit diagram of a drive IGBT reducing the overvoltage byusing a transformer for the top IGBT according to another illustrativeembodiment;

FIG. 7 is a circuit diagram of a drive IGBT reducing the overvoltage byusing a transformer and a resistive divider according to anotherillustrative embodiment;

FIG. 8 is a schematic layout for an IGBT module where the emittedinductance of the top IGBT may be adjusted; and

FIG. 9 is another schematic layout for an IGBT module similar to the oneof FIG. 8.

DETAILED DESCRIPTION

According to an illustrative aspect, there is provided a DC to AC powerconverter including first and second IGBTs each provided with a gate, acollector and an emitter, the gate of the each IGBT is connected to agate driver including a reference; the gate driver reference of thefirst IGBT being connected to a ground bus of the power converter whilethe gate driver reference or the second IGBT being connected to thecollector of the first IGBT; the parasitic inductance of the emitter ofthe second IGBT being increased to allow the control to limit anovervoltage at turn off of the second IGBT.

In accordance to another illustrative aspect, there is provided a DC toAC power converter including a first IGBT provided with a collector, anemitter, a gate and a gate driver including a reference and a secondIGBT provided with a collector, an emitter, a gate and a gate driverincluding a reference, the power converter including:

first and second resistors connected in series and connected across aparasitic inductance of an emitter of the first IGBT; the gate driverreference of the first IGBT being connected to the connection pointbetween the first and second resistor;

a transformer having a primary connected across the parasitic inductanceof a collector of the second IGBT and a secondary connected to theparasitic inductance of an emitter of the second IGBT, the reference ofthe gate driver of the second IGBT being connected to the secondary ofthe transformer.

According to yet another illustrative aspect, there is provided a DC toAC power converter including a first IGBT provided with a collector, anemitter, a gate and a gate driver including a reference and a secondIGBT provided with a collector, an emitter, a gate and a gate driverincluding a reference, the power converter including:

first and second resistors connected in series and connected across aparasitic inductance of the emitter of the first IGBT; the gate driverreference of the first IGBT being connected to the connection pointbetween the first and second resistor;

a transformer having a primary connected across the parasitic inductanceof the collector of the second IGBT and a secondary connected in serieswith the parasitic inductance of the emitter of the second IGBT, thegate driver reference of the second IGBT being connected to thesecondary of the transformer.

The use of the word “a” or “an” when used in conjunction with the term“comprising” in the claims and/or the specification may mean “one”, butit is also consistent with the meaning of “one or more”, “at least one”,and “one or more than one”. Similarly, the word “another” may mean atleast a second or more.

As used in this specification and claim(s), the words “comprising” (andany form of comprising, such as “comprise” and “comprises”), “having”(and any form of having, such as “have” and “has”), “including” (and anyform of including, such as “include” and “includes”) or “containing”(and any form of containing, such as “contain” and “contains”), areinclusive or open-ended and do not exclude additional, unrecitedelements or process steps.

In the present specification and in the appended claims, variousterminology which is directional, geometrical and/or spatial in naturesuch as “longitudinal”, “horizontal”, “front”, rear”, “upwardly”,“downwardly”, etc. is used. It is to be understood that such terminologyis used for ease of description and in a relative sense only and is notto be taken in any way as a limitation upon the scope of the presentdisclosure.

Other objects, advantages and features will become more apparent uponreading of the following non-restrictive description of illustrativeembodiments thereof, given by way of example only with reference to theaccompanying drawings.

The dl/dt at turn-off of the IGBT generates a voltage across the strayinductance of the high frequency loop that is applied across the IGBTabove the bus voltage. Proposed herein is a solution based on theinjection of a sample of the overvoltage across the IGBT in the gatedrive to slow down the slope of the gate voltage to decrease theovervoltage only during the overvoltage period above a predeterminedvalue.

FIG. 1, which is labeled prior art, discloses a third of a three-phasepower converter 10 used, for example, in the powering of a three-phaseelectric motor (not shown) from a battery (also not shown).

Since this kind of converter is believed well known it will not bedescribed in details herein. It is however to be noted that theinductances, inherently provided in the wires, connections, decouplingcapacitor and circuit board traces, have been represented in FIG. 1.

As can be seen from FIG. 1, the reference of each gate driver isconnected to the emitter, typically known as the logical pin, of acorresponding IGBT. For concision purpose, we will describe the bottomportion including the IGBT Q₁.

When the IGBT Q₁ is turned off, the current transit from Q1 to D2, theperiod of the overvoltage; the IGBT must be able to support theovervoltage created by the dl/dt across the various parasiticinductances (L_(c), L_(+bus), L_(c-high), L_(e-high), L_(c-low) andL_(c-low)) that are present in the circuit. Indeed, since theinductances resist change of current therein, additive voltages developin the circuit as can be seen by the polarity of the parasiticinductances illustrated in FIG. 1. These voltages added to the sourcevoltage often result in a voltage that is often greater than the usualmaximal voltage that may safely be present between the collector and theemitter (V_(ce)) of the IGBT.

FIG. 2 illustrates V_(ce), V_(ge) and the current I at turn-off. Onewill notice that there is a major overvoltage of V_(ce) above the busvoltage at the time of turn-off.

Generally stated, by changing the reference of the gate driver from thelogical pin of FIG. 1 to the ground bus (for the bottom IGBT Q₁) and tothe collector of the bottom IGBT (for the top IGBT Q₂), it is possibleto decrease this overvoltage of V_(ce) during turn-off.

In other words, a technique for connecting reference of the gate driverto the power tab of the IGBT instead of to the logical pin has beendeveloped. The voltage across the emitter inductance is injected in thegate driver to create a negative voltage at the emitter of the IGBT toslow down the negative slope of V_(ge), as will be discussedhereinbelow. The result is a direct action on the gate voltage withoutany delay and dl/dt limitations.

Because there is no optimal emitter inductance between the logical andpower connections of the emitter in a commercial IGBT module, atechnique has been developed to optimize the sample of the overvoltageinjected in the gate drive circuit using a resistive divider.

FIG. 3 shows the optimization of the overvoltage with a resistivedivider technique and FIG. 4 the associated wave shape for a bus voltageas high as 500 Vdc.

Again, discussing the bottom portion of the three-phase power converter12 of FIG. 3, the IGBT Q₁ includes a collector 14 having a parasiticinductance L_(c-low), an emitter 16 having a parasitic inductanceL_(e-low) and a gate 18 connected to the gate driver 20 via a resistorR₁. The reference 22 of the gate driver 20 is connected to a resistivedivider circuit including two resistors R₂ and R₃ and a diode D₃ thatallows the turn-on not to be impacted.

The values of the resistors R₂ and R₃ are selected according to thelevel of overvoltage allowed across Q₁. FIG. 4 show the result of aresistive divider optimized for an operation at a bus voltage of 500 Vdcand FIG. 5 at a bus voltage of 300 Vdc. The ratio of R₂ over R₃increases to reduce the overvoltage. The value of the two resistor inparallel is set, in series with R₁, as the gate driver resistor. Thisvalue of the gate resistor is adjusted according to the propercommutation behavior.

By setting the resistor values correctly, it is possible to reduce theeffect of the emitter inductance to get the maximum overvoltage allowedto therefore improve the efficiency.

In other words, the normal practice consisting in using a resistor inthe ground connection of the gate drive to limit the current in thediodes that protect the gate drive of the lower IGBT from a negativevoltage when the upper IGBT turns off has been modified by splitting theresistor in two and adapt the ratio between them to limit the effect ofthe emitter inductance on the dl/dt. The total resistor remains the samebut the voltage divider gives the desired weight of the emitterinductance to limit the overvoltage at the desired level.

The overvoltage should obviously be optimized as much as possible toreach the maximum IGBT rating; this is done by reducing the resistorconnected to the logical emitters R₃ compared to the resistor connectedto the power tab R₂. The voltage across the emitter inductance will besplit in two and only the voltage across the logical resistor will beapplied in the gate drive circuit to limit the gate voltage drop.

It is to be noted that while the resistors R₂ and R₃ are shown connectedacross both parasitic inductances L_(e-low) and L_(bus), they could beconnected solely across parasitic inductance L_(e-low) should thisparasitic inductance be sufficient.

FIG. 4 shows the current I and the voltages V_(ge) and V_(ce) duringturn-off for the circuit of FIG. 3. One skilled in the art will notethat the overvoltage of V_(ce) during turn-off is greatly reduced (seeplateau 24). This plateau 24 occurs while the rate of drop of thevoltage V_(ge) is reduced by the insertion of the voltage from theparasitic inductance.

The duration of the plateau will impact greatly the losses duringturn-off: the longer the plateau, the higher the losses. Because of thedesire to limit at the same time the overvoltage and its length, asquare wave shape of the overvoltage plateau is suitable. The intrinsicbehavior (natural feedback) of the overvoltage gives this shape.

FIGS. 4 and 5 show the square shape of the overvoltage when using theresistive divider at different bus voltages.

This technique works very well for the bottom IGBT because the emitterinductance is large enough but, for the top IGBT, the emitter inductanceis often too small to suitably clamp the voltage without increasing thegate resistor to protect the device. In fact, in practice, the emitterinductance of the top IGBT is very often too low to be used to limit theovervoltage across the top IGBT at the desired level.

Indeed, because of the constraints on packaging of IGBT modules, theupper and lower semiconductors are packaged within close proximity ofeach other so the inductance of the upper IGBT, L_(e-high), is quitesmall, in the order of a few nH. On the other hand, because the onlypoint of connection other than the logical emitter of the lower IGBT isthe power tab of −Vbus, the inductance of the lower IGBT, L_(e-low), is5 times the upper emitter inductance L_(e-high). The connection of the−Vbus tab is highly inductive because of its length and curves.

In other words, all IGBT modules have two power connections, part of thehigh-frequency loop, that are the most inductive: +Vbus and −Vbus.Because −Vbus is in the path of the emitter of the bottom IGBT, it canbe used to inject a sample of the overvoltage across the IGBT in thegate driver of the bottom IGBT. Unfortunately, since the +Vbusconnection is connected to the collector of the top IGBT, thisinductance cannot be used directly as a feedback in the gate driver.

To use Le-high as a feedback in the gate driver, it is thereforerequired to somehow increase its inductance without unduly increase theoverall inductance of the high frequency loop. Two possible techniquesto increase the L_(e-high) inductance will be described hereinbelow.

In order to optimize the top IGBT turn-off, a first technique using thecollector parasitic inductance to inject a sample of the overvoltageacross the top IGBT using a transformer to isolate the collector fromthe emitter has been designed.

FIG. 6 shows the connections of the transformer. More specifically, theprimary of the transformer T1 a is connected across the L_(c-high)parasitic inductance while the secondary of the transformer T1 b isconnected in series with the resistor R₅.

Therefore, a negative voltage appears across the transformer when thecurrent decrease in the top IGBT that applies a negative voltage at theemitter to slow down the slope of the gate voltage. In that case, theoptimization of the overvoltage is also performed by the turn ratio ofthe transformer.

It will be understood that the principle of operation of the circuit ofFIG. 6 is very similar to the principle of operation of the circuit ofFIG. 3, however, since the parasitic inductance of the emitter of thetop IGBT Q₂ (L_(e-high)) is not enough to properly slow down thenegative slope of V_(ce) at turn-off, a sample of the parasiticinductance of the collector of the top IGBT Q₂ (L_(c-high)) is placed inseries with L_(e-high) through a transformer.

FIG. 7 of the appended drawings is a circuit diagram of an IGBT drivereducing the overvoltage by using a combination of a transformer and aresistive divider according to another illustrative embodiment. FIG. 7illustrates a circuit similar to that of FIG. 6. The main differencebetween these circuits is concerned with a resistive divider includingresistors R₅ and R₆ enabling the fine tune of the shape of the negativeslope of the V_(ge).

A second technique to increase the emitter inductance of the top IGBT Q2will now be described with reference to FIGS. 8 and 9, which bothillustrates variations of a layout of an IGBT module. These IGBT modulelayouts are used to make the circuit illustrated in FIG. 3 where, aswill be explained hereinbelow, the parasitic inductance L_(e-high) hasbeen adjusted adequately.

One skilled in the art will understand that increasing the parasiticinductance of the upper IGBT may have an impact on the inductance of thetotal high frequency loop but its impacts on the control of theovervoltage is much more significant.

As can be seen from FIG. 8, the IGBTs 102 forming the IGBT Q2 have acollector mounted to a trace 104, the trace 104 therefore being referredto as C-High and their emitters are connected to emitter pads 106 viawire bonds 110. Similarly, the IGBT 112 forming the IGBT Q1 have acollector mounted to a trace 114 therefore being referred to as C-Lowand their emitters are connected to a trace 118 via wire bonds 120, thetrace 118 therefore being referred to as E-Low.

The trace 114 also has collector pads 116 that are connected thereto.

The +Vbus tab is connected to trace 104 while the −Vbus tab is connectedto trace 118. The phase tab 126 is connected to trace 114.

It is to be noted that the gates of the IGBTs 102 and 112 are notillustrated in FIG. 8 for clarity purpose and since this figures isschematic.

The pads 106 and 116 are interconnected by a U-shaped connector 128having six (6) legs 130 so configured, sized and positioned as toconnect to the pads 106 and 116. One skilled in the art will understandthat the U-shaped connector 128 defined the parasitic inductanceL_(e-high) since it interconnects the emitter of Q2 and the collector ofQ1. Since the U-shape connector 128 is relatively large and includesright angles, the L_(e-high) inductance is relatively high and can beused to limit the overvoltage in the IGBT Q2 as discussed hereinabove.It will also be understood that the size and shape of the connector 128may be determined according to the desired parasitic inductancerequired.

Turning now briefly to FIG. 9, a similar layout for an IGBT module willbe described.

Generally stated, the main difference between the layout of FIG. 8 andthe layout of FIG. 9 is the position of the tabs 106 which arepositioned farther away from the pads 110 to thereby allow a largerconnector 132 and therefore a larger parasitic inductance L_(e-high) tobe used.

It is to be understood that the turn-off overvoltage limiting for IGBTis not limited in its application to the details of construction andparts illustrated in the accompanying drawings and describedhereinabove. The turn-off overvoltage limiting for IGBT is capable ofother embodiments and of being practiced in various ways. It is also tobe understood that the phraseology or terminology used herein is for thepurpose of description and not limitation. Hence, although the abovedescription has been done by way of illustrative embodiments thereof, itcan be modified, without departing from the spirit, scope and nature ofthe subject invention.

What is claimed is:
 1. A DC to AC power converter including first andsecond IGBTs each provided with a gate, a collector and an emitter and atransformer having a primary connected across a parasitic inductance ofthe collector of the second IGBT and a secondary, the gate of the eachIGBT is connected to a gate driver including a reference; the gatedriver reference of the first IGBT being connected to a ground bus ofthe power converter while the gate driver reference of the second IGBTbeing connected to the collector of the first IGBT via the secondary ofthe transformer; the parasitic inductance of the emitter of the secondIGBT being increased by the secondary of the transformer to allow thecontrol to limit an overvoltage at turn off of the second IGBT.
 2. TheDC to AC power converter as recited in claim 1, wherein, for each IGBT,the gate driver includes first and second resistors connected in seriesand connected across a parasitic inductance of the emitter of thecorresponding IGBT; the gate driver reference being connected to theconnection point between the first and second resistors.
 3. The DC to ACpower converter as recited in claim 1, wherein the secondary of thetransformer is connected in series with the parasitic inductance of theemitter of the second IGBT and the first and second resistors.
 4. The DCto AC power converter as recited in claim 1, wherein the parasiticinductance of the emitter of the second IGBT is increased by providing aconnector between the emitter of the second IGBT and the collector ofthe first IGBT, the connector being configured as to provide anincreased equivalent parasitic inductance.
 5. The DC to AC powerconverter as recited in claim 4, wherein the emitter of the second IGBTis connected to emitted pad and wherein the collector of the first IGBTis connected to collector pad; the connector being provided between theemitter pad and the collector pad.
 6. The DC to AC power converter asrecited in claim 5, wherein the emitter pad includes multiple emitterpads and wherein the collector pad includes multiple collector pads. 7.The DC to AC power converter as recited in claim 5, wherein theconnector has a generally U-shaped cross section.
 8. The DC to AC powerconverter as recited in claim 7, wherein the U-shaped connector includeslegs so configured as to be interconnected with the pads.
 9. A DC to ACpower converter including a first IGBT provided with a collector, anemitter, a gate and a gate driver including a reference and a secondIGBT provided with a collector, an emitter, a gate and a gate driverincluding a reference, the power converter including: first and secondresistors connected in series and connected across a parasiticinductance of an emitter of the first IGBT; the gate driver reference ofthe first IGBT being connected to the connection point between the firstand second resistor; a transformer having a primary connected across theparasitic inductance of a collector of the second IGBT and a secondaryconnected to the parasitic inductance of an emitter of the second IGBT,the reference of the gate driver of the second IGBT being connected tothe secondary of the transformer.
 10. The DC to AC power converter asrecited in claim 9, wherein of the gate driver reference is connected tothe secondary of the transformer via a third resistance.
 11. A DC to ACpower converter including a first IGBT provided with a collector, anemitter, a gate and a gate driver including a reference and a secondIGBT provided with a collector, an emitter, a gate and a gate driverincluding a reference, the power converter including: first and secondresistors connected in series and connected across a parasiticinductance of the emitter of the first IGBT; the gate driver referenceof the first IGBT being connected to the connection point between thefirst and second resistor; a transformer having a primary connectedacross the parasitic inductance of the collector of the second IGBT anda secondary connected in series with the parasitic inductance of theemitter of the second IGBT, the gate driver reference of the second IGBTbeing connected to the secondary of the transformer.
 12. The DC to ACpower converter as recited in claim 11, wherein the secondary of thetransformer is connected in series with both the parasitic inductance ofthe emitter of the second IGBT and a third and fourth resistors, thegate driver reference of the second IGBT being connected to theconnection point between the third and fourth resistors.
 13. A DC to ACpower converter as recited in claim 12, wherein the secondary of thetransformer is connected in series with the parasitic inductance of theemitter of the second IGBT, the parasitic inductance of the collector ofthe first IGBT and the third and fourth resistors.
 14. A DC to AC powerconverter including a high frequency loop provided with: bottom and topIGBTs each provided with a gate, a collector and an emitter, the gate ofthe each IGBT is connected to a gate driver including a reference; thegate driver reference of the bottom IGBT being connected to a ground busof the power converter while the gate driver reference of the top IGBTbeing connected to the collector of the bottom IGBT; a parasiticinductance defined by the interconnection of the various elements of thehigh frequency loop; the parasitic inductance of the emitter of the topIGBT and of the collector of the bottom IGBT being part of the parasiticinductance of the high frequency loop; wherein a portion of a voltageinduced in the parasitic inductance of the high frequency loop is addedto a voltage induced in a parasitic inductance of the emitter of the topIGBT and of the collector of the bottom IGBT by a transformer to slowdown the slope of the gate-emitter voltage (Vge) of the top IGBT, thetransformer having a primary connected across a parasitic inductance ofthe high frequency loop and a secondary connected to the gate driver ofthe top IGBT in series with the parasitic inductance of the emitter ofthe top IGBT.
 15. The DC to AC power converter as recited in claim 14,wherein, for each IGBT, the gate driver includes first and secondresistors connected in series and connected across a parasiticinductance of the emitter of the corresponding IGBT; the gate driverreference being connected to the connection point between the first andsecond resistors.